Quality
Waterjet Newsletter – 10/11/2005
Cutting of Microelectronic
Components With AWJ This is Part 1 of a two-part
series on the subject of cutting microelectronic components with waterjets. Part 1 will review an article by Hashish* on
the application of AWJ (Abrasive Water Jet) in this field. Another article on
ASJ (Abrasive Suspension Jet) for the same purpose will be reviewed in Part
2. Flash memory card for cellular
phones is just one example among the family of microelectronic components
that benefit from waterjet cutting. These cards are made on a strip typically
300x100 mm in size and less than 2 mm in thickness. They are then cut into
individual cards of about 11x15 mm in size --- called “singulation”. Tight tolerance (±0.1 mm), smooth edge finish (£ 4 mm, no smearing, no chipping, no delamination,
etc.), and high productivity (³ 2000/hour) are among
the typical requirements of singulation. Traditional methods of singulation
include diamond saw, laser, or waterjet-guided laser. AWJ and ASJ are superior
to these methods in their versatility of cutting different materials without
introducing heat and mechanical distortion. Even though ASJ is capable of
making faster and finer cuts, AWJ was chosen because it is a more matured and
more reliable technology. The actual process used a
combination of AWJ and diamond saw. AWJ makes a partial singulation by
cutting curved pattern in one dimension and then diamond saw finishes it by
cutting parallel straight lines in the other dimension. AWJ process parameters for
singulation include an orifice of 0.075 mm (0.003”) in diameter, a mixing
tube of 0.38 mm (0.015”) in diameter and 50-75 mm (» 2-3”) in length, water pressure of 379 Mpa
(55 kpsi), 220 mesh garnet at 0.75 g/s (0.1
lb/min), and traverse speed of 45 mm/s (106 ipm).
For piercing, pressure is reduced to 82 Mpa (12 kpsi) and garnet flow rate is increased to 1.13 g/s (0.15
lb/min). Some special setups for the nozzle are also used to improve the
process reliability, including vacuum assist and periodically water flushing.
As a conclusion, singulation of
flash memory cards with AWJ is a success. * Hashish, Mohamed, “Abrasive Waterjet Cutting of
Microelectronic Components,” Proceedings of the 2005 WJTA American Waterjet
Conference, Houston, Texas, August 21-23, 2005, Paper 1A-2. Beyond High
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